EPSI INC.  -  Electronics Packaging Solutions International Inc.
Contact us at: P.O. Box 1522, Montclair, NJ 07042 USA, tel.: +1 (973)746-3796, fax: +1 (973)655-0815
e-mail: jpclech@aol.com
Corner joint of a castellated Leadless Ceramic Chip
Carrier (LCCC) on an FR-4 board.  
Photo: courtesy of Dr. L. Wen,
NASA - Jet Propulsion Laboratory.
EXAMPLES OF
CRACKED SOLDER
JOINTS..
Solder joint of a Thin Small Outline Package
(TSOP) with gull-wing lead on an FR-4 board.  
Photo: courtesy of Donna Noctor, AT&T.

(from Noctor, D., Bader, F. E., Viera, A. P., Boysan, P.,
Golwalkar, S. and Foehringer, R., “Attachment reliability
evaluationand failure analysis of thin small outline packages
(TSOPs)”, Proceedings, 43rd ECTC, June 1-4, 1993,
Orlando, FL, pp. 54-61.
Copyright EPSI Inc. 2003-2005.