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| EPSI INC. - Electronics Packaging Solutions International Inc. Contact us at: P.O. Box 1522, Montclair, NJ 07042 USA, tel.: +1 (973)746-3796, fax: +1 (973)655-0815 e-mail: jpclech@aol.com |
LEAD-FREE SOLDER JOINT RELIABILITY WORKSHOP, OCTOBER 20, 2003, FRANKFURT, GERMANY
Monday, October 20, 2003, 8:30am-4:30pm (Hotel InterContinental, Frankfurt):
#T-03: "Lead Free Solder Joint Reliability" by J-P. Clech, EPSI Inc.
For course description and registration, visit the IPC/JEDEC 4th International Conference on Lead Free Electronic
Components and Assemblies web site.
In addition to the workshop hand-outs, attendees will receive a .pdf version of the presenter's extensive reference list on
lead-free assembly reliability. The hand-out also includes a pre-print of a soon-to-be published paper on lead-free solder
material properties.
Monday, October 20, 2003, 8:30am-4:30pm (Hotel InterContinental, Frankfurt):
#T-03: "Lead Free Solder Joint Reliability" by J-P. Clech, EPSI Inc.
For course description and registration, visit the IPC/JEDEC 4th International Conference on Lead Free Electronic
Components and Assemblies web site.
In addition to the workshop hand-outs, attendees will receive a .pdf version of the presenter's extensive reference list on
lead-free assembly reliability. The hand-out also includes a pre-print of a soon-to-be published paper on lead-free solder
material properties.
| Copyright EPSI Inc. 2003. |