LeadFreeReliabilitySeminar

EPSI INC. - Electronics Packaging Solutions International Inc.
Contact us at: P.O. Box 1522, Montclair, NJ 07042 USA, tel.: +1 (973)746-3796, fax: +1 (973)655-0815
e-mail: jpclech@aol.com

LEAD-FREE SOLDER JOINT RELIABILITY: AN OVERVIEW OF THE STATE-OF-THE-ART

A 2.5-3 HOUR WEBCAST SEMINAR WITH QUESTIONS AND ANSWERS

by J-P. Clech, Ph.D, EPSI Inc. (Instructor's Bio)

If you are wondering:

How reliable lead-free assemblies are?
How lead-free stacks-up against standard tin-lead (SnPb)?
What is the impact of board &/or component finishes on lead-free reliability?
What are the reliability risks associated with lead-free or mixed assemblies (lead-free + SnPb)?

this seminar with audio link + webcast presentation will bring you up to speed quickly.

The presentation captures reliability test results and findings from across the industry and around the world, based on our on-
going development of a lead-free reliability database and knowledge-base. The material is being constantly updated to bring
you a synthesis of the best and most important information to-date.

SUMMARY
The presentation takes a close and critical look at the latest reliability information for popular lead-free alloys such as the near-
eutectic Sn-Ag-Cu (SAC). The performance of mixed or lead-free SAC assemblies is compared to that of Sn-Pb
assemblies. Correlations of thermal cycling test results are presented that put in perspective the reliability of SnPb and lead-
free assemblies.

Accelerated test results are presented for common component assemblies. The effects of board and component finish on
assembly reliability are also discussed. The surveyed data indicates a strong dependence of lead-free solder joint reliability on
component type, CTE mismatch as well as test conditions.

TOPICS (PARTIAL LIST)
 Thermal cycling reliability data and failure modes: Sn-Ag, Sn-Ag-Cu, mixed assemblies (SnPb + Lead-free); data for
leadless components (LCCC, discretes), leaded packages (TSOP, QFP), BGA (PBGA, CCGA, CBGA), CSPs, Flip-Chip
with & without underfill.
 Trends: components for which lead-free test life is better or worse than for SnPb assemblies.
 Material properties (incl. creep data, fatigue curves etc…).
 Failure distributions (differences in shape parameters for lead-free vs. SnPb assemblies).
 Failure modes: typical, untypical.
 Impact of components and test conditions (temperature extremes & dwell times) on rank-ordering of lead-free vs. SnPb
solders.
 Effect of component and board finish on lead-free solder joint life (thermal cycling & drop test).
 On-going research: acceleration factors, constitutive models, life prediction models.

HANDOUTS / LICENSE AGREEMENT
In addition to the presented slides, attendees will receive a .pdf file with the presenter’s lead-free
reliability reference list.

The seminar contract includes a license for posting all workshop material onto your internal corporate
web site.

LOGISTICS
This seminar is offered as a corporate-based webcast presentation with audio-link. The number of
participants and/or hooked-up sites is unlimited and is controlled by your own education center or
conference staff.

The presentation lasts 2-2.5 hours with a 1/2 hour scheduled at the end for questions and answers
and/or discussion.

English is the seminar language.

BENEFITS
Beyond the technical contents of the seminar, the main savings to you and the participants are largely
reduced travel time and expenses.

For seminar pricing and further information, please contact Jean-Paul Clech at: tel.: +1 (973)746-3796, e-mail: jpclech@aol.
com