|EPSI INC. - Electronics Packaging Solutions International Inc.
P.O. Box 1522, Montclair, NJ 07042 USA, tel.: +1 (973)746-3796, fax: +1 (973)655-0815
|Our lead-free reliability program includes the development of: 1) a database of lead-free material properties; 2) a
database of assembly reliability data; 3) lead-free life-prediction models and acceleration factors to enable the
much-needed extrapolation of Accelerated Thermal Cycling (ATC) failure times to field conditions.
|TRAINING PROGRAMS CURRENTLY AVAILABLE:
Webcast Seminar: "Lead-Free Solder Joint Reliability: An Overview of the State of the Art" (2.5-3 hours)
In-House Workshop: "Lead-Free Solder Joint Reliability (1 day)".
In-House Seminar: "Lead-Free Solder Joint Reliability (2 days)" ! NEW IN DECEMBER 2005 !
See info to the right
Acceleration factors for SnAgCu assemblies (service available since 4Q 2004)
Material properties (lead-free solders, board & components)
Design and review of mechanical test plans, accelerated test programs
Analysis of test results (incl. comparison to other lead-free designs and assemblies)
Model development (solder constitutive models, life-prediction models, acceleration factors)
|LEAD-FREE RELIABILITY DATABASE
A computerized database of lead-free accelerated life test data, which we use for model validation and comparative analysis
of customers test results.
|LEAD-FREE SOLDER MATERIAL PROPERTY DATABASE
A computerized database of lead-free solder properties (physical, mechanical properties etc...).
If you are looking for specific sets of properties for specific solder alloys, please contact us. If available, we will provide a critical
review of the requested properties under the terms of a consulting project.
NEW SERVICE (4Q2004): Thermal cycling hysteresis loop simulation & ACCELERATION FACTORS for a variety of
lead-free solder alloys.
For preliminary info, see September 2004 news. For more info or to discuss applications, contact Jean-Paul Clech.
The thermal cycling stress/strain simulation is of use, among other things, to optimize thermal cycling profiles so as to reduce test
duration, as well as to develop acceleration factors (currently available & validated for typical SAC solder).
NEW SERVICE (1Q2005): Creep Curve Simulations
We have developed a powerful creep curve simulation technique based on an entirely new creep model that handles both primary
and tertiary creep of lead-free solders. Contrary to conventional wisdom, these two deformation stages are significant and cannot be
ignored for common lead-free solders. This technique is of use for: 1) the development of lead-free solder constitutive models; 2) the
analysis and prediction of creep rupture for lead-free solder alloys.
|LEAD-FREE SOLDER JOINT RELIABILITY MODELS
We believe that robust solder joint life prediction models are those that cover 2-3 orders of magnitude in life and have been tested
against an extensive database of life test results for a variety of components and stress conditions (at least two dozens independent
datasets for model "training" and as many for model validation).
The validation of an adequate solder constitutive model is also a critical part of that effort. Once we have accumulated enough test
data to that effect, we will post an announcement as to a tentative completion date and the availability of a software tool for potential
users of the lead-free reliability model.
|FOR FURTHER INFORMATION, CONTACT:
Jean-Paul Clech, Ph.D. (see biography)
President & Consultant, EPSI Inc.
Home page URL: http://jpclech.com
tel.: +1 (973)746-3796, fax: +1 (973)655-0815
|Copyright EPSI Inc. 2003-2006.