EPSI INC. CONSULTING

EPSI INC. - Electronics Packaging Solutions International Inc.
Contact us at: P.O. Box 1522, Montclair, NJ 07042 USA, tel.: +1 (973)746-3796, fax: +1 (973)655-0815
e-mail: jpclech@aol.com

CONSULTING SERVICES

We help clients in:

 Establishing internal reliability programs: testing strategies, accelerated test plans, design-of-experiment, test vehicles,
design-for-
reliability, life prediction techniques.
 Assessing the reliability of existing or new technologies: BGAs, Flip-Chip, Chip-Scale Packages, SnPb or lead-free
assemblies..
 Design reviews and problem-solving: "fire-fighting", failure analysis, independent audits.

We also offer:

 Modeling services: package and board thermal / mechanical stress analysis (incl. FEA), Acceleration Factors (AF),
statistical analysis, solder joint fatigue and reliability predictions under both thermal and mechanical loads (e.g. vibration),
bump height predictions, model development.
 Software development: custom programs, spreadsheets, Windows applications.
 Measurements: high-sensitivity moiré, in-situ stress/strain measurements, Coefficients of Thermal Expansion (CTE) of
packages, substrates, circuit boards, thin films.
 Expert-witness services related to electronic packages, SMT, circuit boards and solder joint failures.
 Representation at technical events: conferences, standards, committee meetings.
 Research and literature surveys.
 Retainer services: draw on our engineering resources and areas of expertise when problems occur.

EXAMPLES OF CONSULTING PROJECTS WE HAVE WORKED ON:

 Lead-free thermal cycling acceleration factors for automotive, computer & telecommunication products.

 Failure analysis and design improvement for lead-free solder joints in automotive applications.

 Design and reliability assessment of very large (> 1 inch long) electrical solder joints (non-electronic application).

 Mechanical shock and impact analysis for heavy object falling on structural floor (non-electronic application).

 Reliability assessment of over-molded area-array multi-chip module assembly for a laser printer application.

 Evaluation of the attachment of Ceramic Ball Grid Array (CBGA) and Ceramic Column Grid Array (CCGA) packages to
for multiple aerospace applications. Included: model validation, up-front life assessments and estimates of test acceleration
factors.

 Analysis of and design changes for failing solder joints of gull-wing leaded component.

 Development of classical (non-Finite Element based) stress/strain analysis model to predict warpage of large ball grid
array package. Model was implemented in spread-sheet that enabled rapid parametric studies.

 Review and analysis of lead-free solder mechanical properties.

 Material selection and pad size optimization for a Chip Scale Package (CSP) with small and large semiconductor chips.

NO PROJECT IS TOO SMALL OR TOO BIG:

Request-For-Quotations (RFQs) are welcome. After discussion and review of the scope and goals of your project, we will
provide a written proposal with work plan and deliverables. Pricing arrangments are on an hourly basis or on a project
(fixed-cost) basis. Retainer services are also available for on-going consulting.

TO DISCUSS YOUR SPECIFIC NEEDS, PLEASE CONTACT:
Jean-Paul Clech, tel: +1 (973)746-3796, e-mail: jpclech@aol.com