|EPSI INC. - Electronics Packaging Solutions International Inc.
P.O. Box 1522, Montclair, NJ 07042 USA, tel. & fax: +1 (973)746-3796
Jean-Paul ("JP") Clech is the founder of EPSI Inc. in Montclair, New-Jersey. His activities at EPSI include world-wide technical consulting for
clients in the electronics industry, problem-solving, expert-witness consulting and court testimony, the development of mechanical design &
design-for-reliability tools and professional training seminars. He is the principal developer of the Solder Reliability Solutions model and
application software, and has consulted on the physical design of a variety of electronic components and small to very large electronic board
assemblies. His professional interests cover multi-disciplinary aspects of electronics packaging, Surface Mount Technology (SMT) and circuit
board assemblies, with emphasis on materials characterization and the application of materials and mechanical engineering principles to sound
product design. He is constantly challenged by design, failure and reliability problems brought about by emerging packaging and soldering
technologies and the application of SMT in harsh environments. His current technical interests are in the areas of electronic circuit-board
vibrations, flip-chip assemblies, chip scale packages, lead-free solder material properties and reliability.
Jean-Paul previously was a member of the technical staff and then consultant at AT&T Bell Laboratories, and manager of electronic packaging at
a European super-computer start-up. He received the "Diplôme d’Ingénieur" degree (Materials Science major) from Ecole Centrale de Paris,
France, and the M.S. and Ph.D. degrees in Mechanical Engineering from Northwestern University, Evanston, Illinois. His interest in soldering
and solder materials started during a post-doctoral assignment in the Materials Science department at Northwestern University. He is a
recognized expert in the field of surface mount assembly quality and reliability and has assisted law firms as an expert witness on packaging,
board and soldering related failures & patent infringement cases.
Jean-Paul is an active member of the American Society of Mechanical Engineers - ASME, the Institute of Electrical and Electronic Engineers -
IEEE, the Surface Mount Technology Association - SMTA, and the Minerals, Metals and Materials Society - TMS.
He has published over forty papers and three book chapters, and has chaired numerous workshops and technical sessions at international
conferences. He has worked in and has been an invited speaker, lecturer and seminar leader at corporations, universities and R&D institutions in
Africa, Asia, Europe and North America. While at AT&T Bell Laboratories, Jean-Paul received several Exceptional Contribution Awards. In
2003, he received the Member of Distinction Award from the Surface Mount Technology Association (SMTA). In 2006, he was presented with
the IPC's Distinguished Committee Service award in appreciation and recognition of his contribution to the development of IPC-9701A,
Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments.
Jean-Paul is an avid reader, writer, cyclist, sailor and music / jazz lover. Interested in jazz, jazz history & education? Please visit and
enjoy the site of the Thelonious Monk Institute of Jazz or Jazz in America: The National Jazz Curriculum .
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