EPSI INC.  -  Electronics Packaging Solutions International Inc.
P.O. Box 1522, Montclair, NJ 07042 USA, tel. & fax: +1 (973)746-3796
We work on the physical design, reliability and failure analysis of electronic components, solder joints and circuit-board assemblies.  We
provide expertise in the assessment of both standard tin-lead (SnPb) and lead-free (Pb-free) solder joint reliability.  
What is this about?

We help our customers meet the reliability requirements of electronic packages and circuit-board assemblies.  To that effect, we offer:
Consulting Services    Training Programs    Software Tools   Technical Support & Retainer Services   Expert-Witness Services

No hype, no unsupported claims...
We provide hard data, test plans and analysis along with recommendations for problem-solving or product improvements.  We maintain
and grow one of the largest databases of solder properties, reliability models and failure data in the electronics industry. Our
Reliability Solutions (SRS) software is one of the most widely used solder joint life prediction program in industry
- see
Independent Reviews and Users' Comments .
Q4 2020

    Electronic products marketed in the European Union, mainland China and a growing number of areas, must now meet lead-free
    requirements.  Are you concerned about lead-free reliability?  Give us a call or sign up for our upcoming seminars or webinars.


  • November 21, 2020: NEW Office Number: +1 (973)259-6219,  EFFECTIVE NOW.
    Our current office number: +1 (973)746-3796 remains valid until the end of the year (2020).

  • November 21, 2020: NEW! Solder joint life predictions are now available for SAC305 assemblies and
    other mainstream SAC alloy compositions.   This service makes use of a proprietary, newly developed strain energy
    model that has been tested and validated against extensive industry data.  The service is available under contract, subject to a
    Non-Disclosure Agreement between EPSI Inc. and its customers.   For more information, e-mail  Jean-Paul Clech.

  • October 14, 2020: 3.5-hour webinar: "Lead-free Solder Joint Reliability Basics" by J-P. Clech.  For access to audio-recording
    of webinar, contact Sharon at Hobbs Engineering: learn@hobbsengr.com , tel.: +1 303-655-3051.

  • Coming soon: Solder Reliability Solutions ("SRS"), Version 2.0.  Thank you for your patience.


  • Recent article:   Clech, J.-P. (EPSI Inc.), Coyle, R. J. (Nokia Bell Labs) and Arfaei, B. (Ford Motor Co. & Binghamton U.), "Pb-Free
    Solder Joint Thermo-Mechanical Modeling: State of the Art and Challenges", JOM (TMS), Advances in Electronic
    Interconnection Materials, January 2019.  Available for download.

Quote of the month (not necessarily monthly):

"All models are wrong, but some are useful", George E. P. Box, British statistician.

Past Quotes of the Month.
Public lead-free
reliability workshops
or webinars:

TBD, 2021: webinar,
hosted by

Lead-Free (Pb*-free)
ain't Problem-free but
can be made as
reliable as need be.
Find out what the
issues are and how
they are being

*Pb = Plumbum (Latin)
FOR FURTHER INFO, CONTACT:  Jean-Paul Clech ( bio), e-mail: jpclech@aol.com
Copyright EPSI Inc. 2003-2020.  This site was last updated on November 21, 2020.