|EPSI INC. - Electronics Packaging Solutions International Inc.
P.O. Box 1522, Montclair, NJ 07042 USA, tel. & fax: +1 (973)746-3796
|WHAT WE DO
We work on the physical design, reliability and failure analysis of electronic components, solder joints and circuit-board assemblies. We
provide expertise in the assessment of both standard tin-lead (SnPb) and lead-free (Pb-free) solder joint reliability. What is this about?
We help our customers meet the reliability requirements of electronic packages and circuit-board assemblies. To that effect, we offer:
Consulting Services Training Programs Software Tools Technical Support & Retainer Services Expert-Witness Services
HOW WE DO IT
No hype, no unsupported claims...
We provide hard data, test plans and analysis along with recommendations for problem-solving or product improvements. We maintain
and grow one of the largest databases of solder properties, reliability models and failure data in the electronics industry. Our Solder
Reliability Solutions (SRS) software is one of the most widely used solder joint life prediction program in industry
- see Independent Reviews and Users' Comments .
Electronic products marketed in the European Union, mainland China and a growing number of areas, must now meet lead-free
requirements. Are you concerned about lead-free reliability? Give us a call or sign up for our upcoming seminars or webinars.
NEWS & UPCOMING EVENTS
February 25, 2018, IPC APEX 2018, Professional Development Course:
"Solder Joint Reliability in Electronic Assemblies" (3 hours), by J-P. Clech,
San Diego Convention Center, San Diego, CA.
June 6, 2018: 3-hour webinar: "Lead-free Solder Joint Reliability Basics" by J-P. Clech. For more info and registration, contact
Sharon at Hobbs Engineering: email@example.com , tel.: +1 303-655-3051.
PAST NEWS & WEBINAR RECORDINGS
Virginia Hobbs at Hobbs Engineering: firstname.lastname@example.org , tel.: +1 (303)655-3051.
as BEST OF PROCEEDINGS PAPER. Download SMTAI 2009 presentation (.pdf file).
The paper: "Closed form, strain energy based acceleration factors for thermal cycling of lead-free assemblies", by J-P. Clech,
Ph. D., Henshall, G., Ph. D. and Miremadi, J., can be purchased (with the 2009 SMTAI Proceedings) from the SMTA bookstore at
Quote of the month (not necessarily monthly):
"The purpose of computing is insight, not numbers ", Richard W. Hamming.
...Past Quotes of the Month.
|Next public lead-free
Feb. 25, 2018: IPC
workshop, San Diego.
June 6, 2018:
webinar, hosted by
ain't Problem-free but
can be made as
reliable as need be.
Find out what the
issues are and how
they are being
*Pb = Plumbum (Latin)
|Copyright EPSI Inc. 2003-2018. This site was last updated on February 24, 2018