|EPSI INC. - Electronics Packaging Solutions International Inc.
P.O. Box 1522, Montclair, NJ 07042 USA, tel. & fax: +1 (973)746-3796
|WHAT WE DO
We work on the physical design, reliability and failure analysis of electronic components, solder joints and circuit-board assemblies. We
provide expertise in the assessment of both standard tin-lead (SnPb) and lead-free (Pb-free) solder joint reliability. What is this about?
We help our customers meet the reliability requirements of electronic packages and circuit-board assemblies. To that effect, we offer:
Consulting Services Training Programs Software Tools Technical Support & Retainer Services Expert-Witness Services
HOW WE DO IT
No hype, no unsupported claims...
We provide hard data, test plans and analysis along with recommendations for problem-solving or product improvements. We maintain
and grow one of the largest databases of solder properties, reliability models and failure data in the electronics industry. Our Solder
Reliability Solutions (SRS) software is one of the most widely used solder joint life prediction program in industry
- see Independent Reviews and Users' Comments .
"THERE IS NO SHORTCUT TO RELIABILITY".
requirements. Are you concerned about lead-free reliability? Give us a call and we'll help you figure it out.
"A Pseudo-Stress, Pseudo-Strain Methodology to Predict Lead-Free Solder Joint Reliability"
in technical session: Modeling and Predictions in Harsh Operational Environments , Oct. 14, 2013, 10:30am
or e-mail to designated licensed users. See latest brochure.
- A 3-hour WEBCAST: SOLDER JOINT RELIABILITY: BACK TO THE BASICS was recorded on June 28, 2012.
- A 3-hour WEBCAST on Acceleration Factors for Lead Free Solder Joint Reliability - including a review of and discussion of
SEVEN different acceleration factor models that have been developed for lead-free soldered assemblies -
was recorded on March 23, 2010.
To get access to the presentation materials & audio recordings of these two webinars, contact:
Virginia Hobbs at Hobbs Engineering: email@example.com , tel.: +1 (303)655-3051.
as BEST OF PROCEEDINGS PAPER. Download SMTAI 2009 presentation (.pdf file).
The paper: "Closed form, strain energy based acceleration factors for thermal cycling of lead-free assemblies", by J-P. Clech,
Ph. D., Henshall, G., Ph. D. and Miremadi, J., can be purchased (with the 2009 SMTAI Proceedings) from the SMTA bookstore at
"Victory belongs to the most persevering", Napoleon Bonaparte.
...Past Quotes of the Month.
|Next public lead-free
None scheduled at the
ain't Problem-free but
can be made as
reliable as need be.
Find out what the
issues are and how
they are being
*Pb = Plumbum (Latin)
|Copyright EPSI Inc. 2003-2013. This site was last updated on July 23, 2013